Feature analysis and classification of manufacturing signatures based on semiconductor wafer maps

Feature analysis and classification of manufacturing signatures based on semiconductor wafer maps

Author(s):

Tobin,K.W. ( Oak Ridge National Lab. )
Gleason,S.S.
Karnowski,T.P.
Cohen,S.L.

Publication title:

Machine Vision Applications in Industrial Inspection V

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3029

Pub. Year:

1997

Page(from):

14

Page(to):

25

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819424402 [0819424404]

Language:

English

Call no.:

P63600/3029

Type:

Conference Proceedings

Details

TDL ID:	ZA00020293
Series ID:	PA00000029
Conf. info. (Name):	IS&T/SPIE Electronic Imaging : Machine Vision Applications in Industrial Inspection
Conf. info. (Number):	1997 : 5th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1997.02.10-1997.02.11

Similar Items:

1 Conference Proceedings Automatic classification of spatial signatures on semiconductor wafer maps Tobin,K.W., Gleason,S.S., Karnowski,T.P., Cohen,S.L., Lakhani,F. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Image paradigm for semiconductor defect data reduction Tobin,K.W., Gleason,S.S., Karnowski,T.P., Sari-Sarraf,H., Bennett,M.H. SPIE-The International Society for Optical Engineering
2 Conference Proceedings An Integrated Spatial Signature Analysis and Automatic Defect Classification System Gleason,S.S., Tobin,K.W., Karnowski,T.P. SPIE-The International Society for Optical Engineering	8 Conference Proceedings Detection of semiconductor defects using a novel fractal encoding algorithm Gleason, S.S., Ferrell, R.K., Karnowski, T.P., Tobin, K.W., Jr. SPIE-The International Society for Optical Engineering
3 Conference Proceedings An Integrated Spatial Signature Analysis and Automatic Defect Classification System Gleason, S.S., Tobin, K.W., Karnowski, T.P. Electrochemical Society	9 Technical Paper Fuzzy Logic Connectivity in Semiconductor Defect Clustering Karnowski, T.P., Gleason, S.S., Tobin, K.W., Jr. Society of Manufacturing Engineers
4 Conference Proceedings Fuzzy logic connectivity in semiconductor defect clustering Karnowski,T.P., Gleason,S.S., Tobin,K.W.,Jr. SPIE-The International Society for Optical Engineering	10 Conference Proceedings Content-based image retrieval for semiconductor manufacturing Karnowski,T.P., Tobin,K.W.,Jr., Ferrell,R.K., Lakhani,F. SPIE - The International Society for Optical Engineering
5 Conference Proceedings Adaptation of the fuzzy k-nearest neighbor classifier for manufacturing automation Tobin,K.W.,Jr., Gleason,S.S., Karnowski,T.P. SPIE-The International Society for Optical Engineering	11 Conference Proceedings Integrated applications of inspection data in the semiconductor manufacturing environment Tobin Jr.,K.W., Karnowski,T.P., Lakhani,F. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Rapid yield learning through optical defect and electrical test analysis Gleason,S.S., Tobin,K.W., Karnowski,T.P., Lakhani,F. SPIE-The International Society for Optical Engineering	12 Conference Proceedings Survey of semiconductor data management systems technology Tobin,K.W., Karnowski,T.P., Lakhani,F. SPIE - The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12