Blank Cover Image

Wafer level thin-film solder bonding of a hybrid sensor for interfacial force microscopy

Author(s):
Publication title:
Micromachining and Imaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3009
Pub. Year:
1997
Page(from):
25
Page(to):
32
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424204 [081942420X]
Language:
English
Call no.:
P63600/3009
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Magnetic Force Microscopy on Thin Film Magnetic Recording Media

Porthun S., Ruhrig M., Lodder C. J.

Kluwer Academic Publishers
7 Conference Proceedings Wafer Level Micropackaging Of MEMS Devices Using Thin Film Anodic Bonding

Rohwer, Lauren E.S., Oliver, Andrew D., Collins, Melissa V.

Materials Research Society
2 Conference Proceedings Bonding and Contacting of MEMS-Structures on Wafer Level

Wiemer, M., Fromel, J., Jia, C., Gessner, T.

Electrochemical Society
8 Conference Proceedings Synthesis and Atomic Force Microscopy Contact Current Images of Aluminum Doped ZnO Thin Films

N. Muñoz Aguirre, J.E. Rivera-López, L. Martínez Pérez, P.A. Tamayo Meza

Trans Tech Publications
3 Conference Proceedings Shear Modulation Force Microscopy Studies on Cross-linked Elastomer Thin Films

Rafailovich, M.H., Zhang, Y., Peiffer, D.G., Ge, S., Sokolov, J.C., Dias, A.J.

Materials Research Society
9 Conference Proceedings New quality control parameter in wafer fabrication for wire bonding integrity

Tan,C.M., Zhang,G.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Integratible process for fabrication of fluidic microduct networks on a single wafer

Matzke,C.M., Ashby,C.I.H., Bridges,M.M., Griego,L., Wong,C.C.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings In-Situ Fluorescence Microscopy of Al Thin Film Corrosion at Engineered Cu Islands

Missert, N., Copeland, R.C., Barbour, J.C., Mikkalson, J.E., Isaacs, H.

Electrochemical Society
5 Conference Proceedings *Mechanistic studies of wafer bonding and thin silicon film exfoliation

Chabal, Y. J., Isaacs, E. D., Weldon, M. K.

MRS-Materials Research Society
11 Conference Proceedings On scaling the thin film Si thickness of SOI substrates. A Perspective on Wafer Bonding for Thin Film Devices

Hobart, K.D., Kub, F.J., Twigg, M.E., Fatemi, M.

Kluwer Academic Publishers
6 Conference Proceedings Characterization of thin film MEMS using photo-acoustic microscopy

Hernandez,C.M., Murray,T.W., Krishnaswamy,S.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Friction Force Microscopy of Organic Thin Films and Crystals

Fujihira M.

Kluwer Academic Publishers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12