Expansion Behavior of Epoxy Encapsulated Integrated Circuits

Expansion Behavior of Epoxy Encapsulated Integrated Circuits

Author(s):

Bair, H. E. ( AT&T Bell Laboratories )
Boyle, D. J. ( Central State University )
Steiner, K. G.
Young, A. L.

Publication title:

Plastics-pioneering the 21st century : conference proceedings

Title of ser.:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

Ser. no.:

33

Pub. Year:

1987

Page(from):

362

Page(to):

364

Pages:

3

Pub. info.:

Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)

Language:

English

Call no.:

S42700/880310

Type:

Conference Proceedings

Details

TDL ID:	ZA00020152
Series ID:	PA00000030
Conf. info. (Name):	ANTEC '87 : Society of Plastics Engineers Annual Technical Conference and Exhibit
Conf. info. (Number):	45th
Conf. info. (Venue):	Los Angeles, CA, USA
Conf. info. (Date):	1987.05.04-1987.05.07
Note for article:	ELECTRICAL AND ELECTRONIC DIVISION

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