THE EFFECT OF THERMAL HISTORY ON INTERCONNECT RELIABILITY
- Author(s):
- Thompson, C. V.
- Publication title:
- Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 309
- Pub. Year:
- 1993
- Page(from):
- 383
- Pub. info.:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558992054 [1558992057]
- Language:
- English
- Call no.:
- M23500/309
- Type:
- Conference Proceedings
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