ELECTROMIGRATION DAMAGE IN FINE Al ALLOY LINES DUE TO INTERFACIAL DIFFUSION
- Author(s):
Hu, C-K. Small, M. B. Rodbell, K. P. Stanis, C. Mazzeo, N. Blauner, P. Rosenberg, R. Ho, P. S. - Publication title:
- Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 309
- Pub. Year:
- 1993
- Page(from):
- 111
- Pub. info.:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558992054 [1558992057]
- Language:
- English
- Call no.:
- M23500/309
- Type:
- Conference Proceedings
Similar Items:
MRS - Materials Research Society |
Materials Research Society |
MRS - Materials Research Society |
8
Conference Proceedings
LOCAL TEXTURE AND ELECTROMIGRATION IN FINE LINE MICROELECTRONIC ALUMINUM METALLIZATION
MRS - Materials Research Society |
3
Conference Proceedings
Copper Migration and Precipitate Dissolution in Aluminum/Copper Lines During Electromigration Testing
MRS - Materials Research Society |
9
Conference Proceedings
In Situ X-ray Microbeam Cu Fluorescence and Strain Measurements on Al(0.5 at.% Cu) Conductor Lines During Electromigration
MRS - Materials Research Society |
Materials Research Society |
10
Conference Proceedings
Electromigration in Two-Level Cu Interconnections with a Low Dielectric Constant Inter-Level Insulator
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |