Blank Cover Image

Reliability Studies of Cu Using Wafer Level Joule Heated Electromigration Test

Author(s):
Publication title:
Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
564
Pub. Year:
1999
Page(from):
365
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994713 [1558994718]
Language:
English
Call no.:
M23500/564
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electromigration Testing of Via Terminated Test Structures

Low, K. S., Poetzlberger, H., O'Neill, A.

MRS - Materials Research Society
7 Conference Proceedings Impact of Ge Diffusion and Wafer Cross Hatching on Strained Si MOSFET Electrical Parameters

Driscoll, L., Olsen, S., Chattopadhyay, S., O'Neill, A., Kwa, K., Dobrosz, P., Bull, S.

Materials Research Society
2 Conference Proceedings Evaluation of Current Ramp Test for In-Line Electromigration Test

Low, K. S., Glasow, A. von, Poetzlberger, H., O'Neill, A.

MRS - Materials Research Society
8 Conference Proceedings Direct Correlation Between Grain Configuration and Electromigration Damage Development

Shih, W. C., Ghiti, A., Low, K. S., Greer, A. L., O'Neill, A. G., Walker, J. F.

MRS - Materials Research Society
3 Conference Proceedings Modeling the Mechanisms of Cu-Enhanced Median Time to Failure in Al-Cu Interconnects Under Electromigration

Low, K. S., Shih, W. C., Greer, A. L., Ghiti, A., O'Neill, A. G.

MRS - Materials Research Society
9 Conference Proceedings IMPROVED SAFETY AND RELIABILITY OF CHEMICAL AND PETROLEUM PLANTS

Bendixen, L. M., Dale, S. E., O'Neill, J. K.

American Institute of Chemical Engineers
4 Conference Proceedings Failure analysis of wafer-level reliability testing failure

Oh,C.K., Neo,S.P., Bi,J.H., Wu,Z.M., Goh,L.C., Redkar,S.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings Transition Region and Coronal Loops Heated by Turbulence

X. Li, I. O'Neill, S. R. Habbalp

ESA Publications Division
5 Conference Proceedings Electromigration Reliability Of Dual-Damascene Cu/Oxide Interconnets

Ogawa, E.T., Blaschke, V.A., Bierwag, A., Lee, K., Matsuhashi, H., Griffiths, D., Ramamurthi, A., Justison, P.R., …

Materials Research Society
11 Conference Proceedings Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K.-W., Kraft, R.P., Altemus, B., Cheng, D., Eisenbraun, E., Cale, …

Electrochemical Society
6 Conference Proceedings Electromigration Reliability Assessment of Cu-based Metallization Systems by a Wafer-Level Approach

M. Impronta, A. Marras, I. De Munari, A. Scorzoni, M. Grazia Valentini

Electrochemical Society
12 Conference Proceedings Simple Computer Modeling of the Grain Microstructure of Al-4 wt% Cu Interconnection Lines

Low, K. S., Bull, S. J., O'Neill, A. G.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12