The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach

Author(s):

Publication title:

Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

516

Pub. Year:

1998

Page(from):

357

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994225 [155899422X]

Language:

English

Call no.:

M23500/516

Type:

Conference Proceedings

Details

TDL ID:	ZA00019845
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability in microelectronics
Conf. info. (Number):	8th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1998.04.13-1998.04.16

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