Thermal Stresses, Interfacial Reactions, and Microstructures of Al/Ti and Al/TiN Thin Films Encapsulated by SiOF

Thermal Stresses, Interfacial Reactions, and Microstructures of Al/Ti and Al/TiN Thin Films Encapsulated by SiOF

Author(s):

Publication title:

Low-dielectric constant materials III : symposium held April 1-4, 1997, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

476

Pub. Year:

1997

Page(from):

267

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993808 [1558993800]

Language:

English

Call no.:

M23500/476

Type:

Conference Proceedings

Details

TDL ID:	ZA00019841
Series ID:	PA00000011
Conf. info. (Name):	Symposium on low-dielectric constant materials
Conf. info. (Number):	3rd
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1997.04.01-1997.04.04

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