Chemical Mechanical Polishing of Polymer Films: Comparison of Benzocyclobutene(BCB) and Parylene-N Films by XPS and AFM
- Author(s):
- Publication title:
- Low-dielectric constant materials III : symposium held April 1-4, 1997, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 476
- Pub. Year:
- 1997
- Page(from):
- 161
- Pub. info.:
- Pittsburgh, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558993808 [1558993800]
- Language:
- English
- Call no.:
- M23500/476
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Investigations of the Chemical-Mechanical Polishing of Polymer Films for ILD Applications
MRS - Materials Research Society |
Materials Research Society |
2
Conference Proceedings
SURFACE LAYER FORMATION DURING THE CHEMICAL MECHANICAL POLISHING OF COPPER THIN FILMS
MRS - Materials Research Society |
Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
5
Conference Proceedings
Low Dielectric Constant Polymers for On-Chip Interlevel Dielectrics with Copper Metallization
MRS - Materials Research Society |
MRS - Materials Research Society |
6
Conference Proceedings
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.
Materials Research Society |
Electrochemical Society |