Improved overlay measurement of CMP processed layers

Improved overlay measurement of CMP processed layers

Author(s):

Yeo,J.-H. ( Samsung Electronics Co.,Ltd. )

Publication title:

Metrology, Inspection, and Process Control for Microlithography X

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2725

Pub. Year:

1996

Page(from):

345

Page(to):

354

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819421012 [0819421014]

Language:

English

Call no.:

P63600/2725

Type:

Conference Proceedings

Details

TDL ID:	ZA00019794
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology,Inspection, and Process Control for Microlithography
Conf. info. (Number):	1996 : 10th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1996.03.11-1996.03.13

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