Effects of Element Segregation on Nanometer Grain Boundary Sliding in Copper

Effects of Element Segregation on Nanometer Grain Boundary Sliding in Copper

Author(s):

Publication title:

Intergranular and interphase boundaries in materials : iib95 : proceedings of the 7th International Conference on Intergranular and Interphase Boundaries in Materials held in Lisboa, Portugal, June 26-29, 1995

Title of ser.:

Materials science forum

Ser. no.:

207-209

Pub. Year:

1996

Pt.:

1

Page(from):

165

Page(to):

168

Pub. info.:

Zurich-Uetikon, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878497225 [0878497226]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00019752
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Intergranular and Interphase Boundaries in Materials
Conf. info. (Number):	7th
Conf. info. (Venue):	Lisboa, Portugal
Conf. info. (Date):	1995.06.26-1995.06.29

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