Effect of Processing Variables on the Co-Fired Properties of Thick Film Resistors in LTCC

Effect of Processing Variables on the Co-Fired Properties of Thick Film Resistors in LTCC

Author(s):

Ehlert,Michael ( National Semiconductor Corporation )
Munoz,Patrick S.

Publication title:

Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3582

Pub. Year:

1998

Page(from):

926

Page(to):

931

Pub. info.:

Bellingham, Wash. — Reston, VA: SPIE - The International Society for Optical Engineering — IMAPS

ISSN:

0277786X

ISBN:

9780930815523 [0930815521]

Language:

English

Call no.:

P63600/3582

Type:

Conference Proceedings

Details

TDL ID:	ZA00019455
Series ID:	PA00000029
Conf. info. (Name):	International symposium on microelectronics
Conf. info. (Number):	1998
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.11.01-1998.11.04

Similar Items:

1 Conference Proceedings Evaluation of New GaRuO3 Thick Film Resistor Formulations Compatible with LTCC Co-Firing Klein, Randy, Kinzy Jones, W. IMAPS	7 Conference Proceedings Embedded High K Ceramic Capacitors in LTCC for Wireless Communication Applications Ehlert,Michael R., Branchevsky,Shaul SPIE - The International Society for Optical Engineering
2 Conference Proceedings Thick Film Screen-Printable Buried Resistors Mason,Robert C., Bolton,Patrick J. SPIE - The International Society for Optical Engineering, IMAPS	8 Conference Proceedings Effect of Design Parameters on Overstress Characterization of Thick Film Resistors for Lightning Surge Protection Vasudevan,S. IMAPS
3 Conference Proceedings Electrical and Structural Characterization of Thick Film Resistors at various LTCC Systems Golonka,Leszek J., Dziedzic,A., Henke,M., Kita,J., Thust,H., Drue,K.-H., Bauer,R., Rebenklau,L., Wolter,K.-J. SPIE - The International Society for Optical Engineering	9 Conference Proceedings Highly Reliable and Lead (Pb) Free Thick Film Resistor Paste System for Low Thermal Expansion LTCC Application Masashi,Fukaya., Matsuo,Tomoko., Nisigaki,Susumu., Higuchi,Chiaki. IMAPS
4 Conference Proceedings "High Density LTCC Technology, Using Photo Patterned Conductors" Barnwell,Peter, Ehlert,Michael SPIE-The International Society for Optical Engineering	10 Conference Proceedings Photo Patterned Conductors with LTCC for Microwave and High Density Interconnect Barnwall, Peter, Smith, Brent, Ehlert, Michael IMAPS
5 Conference Proceedings Thick Film Temperature Variable Attenuators Marie,Michael.J., Mazzochette,J., Feingold,A.H., Amstutz,P., Wahlers,R.L., Huang,C., Stein,S.J. IMAPS	11 Conference Proceedings Characterization of Unrestrained Zero Shrink LTCC Material System for Volume Production of RF LTCC Modules Ehlert, Michael, Spenser, Barbie, Lautzenhiser, Frans, Amaya, Edmar IMAPS
6 Conference Proceedings PERFORMANCE OF LTCC MATERIALS SYSTEMS IN 2 GHZ RESONATOR APPLICATIONS Ehlert,Michael R., Draudt,Rick IMAPS	12 Conference Proceedings IMPEDANCE SPECTROSCOPY OF THE POLYMER THICK FILM RESISTOR/CONDUCTOR INTERFACE Jussila, S., Stubb, H., Pienimaa, S. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12