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Comparison of Stud Bump Bonding Technology and Other Flip-Chip Technologies

Author(s):
Publication title:
Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3582
Pub. Year:
1998
Page(from):
639
Page(to):
644
Pub. info.:
Bellingham, Wash. — Reston, VA: SPIE - The International Society for Optical Engineering — IMAPS
ISSN:
0277786X
ISBN:
9780930815523 [0930815521]
Language:
English
Call no.:
P63600/3582
Type:
Conference Proceedings

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