Creep Relaxation of Pb-Sn-In Solder Alloys in Soldered Assemblies
- Author(s):
- Jones,W.K. ( Florida International University )
- Shah,Milind P.
- Liu,Y.Q.
- Publication title:
- Microelectronics : 1-4 November 1998, San Diego Convention Center, San Diego, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3582
- Pub. Year:
- 1998
- Page(from):
- 59
- Page(to):
- 62
- Pub. info.:
- Bellingham, Wash. — Reston, VA: SPIE - The International Society for Optical Engineering — IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815523 [0930815521]
- Language:
- English
- Call no.:
- P63600/3582
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Phase Field Modeling of Recrystallization Grain Growth during Re-Aging Process in Cu-Ni-Si Alloy
Trans Tech Publications |
Trans Tech Publications |
Trans Tech Publications |
Kluwer Academic Publishers |
Society of Photo-optical Instrumentation Engineers |
9
Conference Proceedings
Numerical Simulation of Spinodal Deposition in Cu-6at.%Ni-3at.%Si Ternary Alloy Using of Phase Field Method
Trans Tech Publications |
Trans Tech Publications |
10
Conference Proceedings
Heusler Type CoNiGa Alloys with High Martensitic Transformation Temperature
Trans Tech Publications |
Trans Tech Publications |
11
Conference Proceedings
Microstructures, Tensile Properties and Forming Process of AZ31 Alloy Sheets
Trans Tech Publications |
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
Creep Study for Fatigue Life Assessment of Two Lead-Free High-Temperature Solder Alloys
MRS - Materials Research Society |