Blank Cover Image

Macroscopic Modelling of Fine Line Adhesion Tests

Author(s):
Publication title:
Materials reliability in microelectronics IX : symposium held April 6-8, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
563
Pub. Year:
1999
Page(from):
297
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994706 [155899470X]
Language:
English
Call no.:
M23500/563
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings ADHESION OF TUNGSTEN FINE LINES ON SiO2 BY MICRO-WEDGE SCRATCHING

Boer, M. P. de, Huang, H., Nelson, J. C., Wang, F., Gerberich, W. W.

MRS - Materials Research Society
7 Conference Proceedings Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayers

Volinsky, A. A., Gerberich, W. W.

MRS - Materials Research Society
2 Conference Proceedings Quantitative Modelling and Measurement of Copper Thin Film Adhesion

Volinsky, A. A., Tymiak, N. I., Kriese, M. D., Gerberich, W. W., Hutchinson, J. W.

MRS - Materials Research Society
8 Conference Proceedings THIN FILM FINE LINE WORK OF ADHESION BY MICROWEDGE INDENTATION

Boer, M. P. de, Moody, N. R., Huang, H., Gerberich, W. W.

MRS - Materials Research Society
3 Conference Proceedings Finite Element Analysis of the Precracked Line Scratch Test

Volinsky, A.A., Mercado, L., Sarihan, V., Gerberich, W.W.

Materials Research Society
9 Conference Proceedings EVALUATION OF ADHESION STRENGTH IN A Ti/Al2O3 COMPOSITE

Wang, Hsin-Fu, Nelson, John C., Lin, Chien-Li, Gerberich, William W., Skowronek, Charles J., Deve, Herve E.

MRS - Materials Research Society
4 Conference Proceedings ADHESION STRENGTH OF Cu/POLYIMIDE MEASURED BY CONTINUOUS MICRO-WEDGE SCRATCH TEST

Wang, F., Nelson, J. C., Huang, H., Boer, M. de, Gerberich, W. W., Swisher, R. L.

MRS - Materials Research Society
10 Conference Proceedings Environmental Effects on Cu/SiO2 and Cu/Ti/SiO2 Thin Film Adhesion

Tymiak, N. I., Li, M., Volinsky, A. A., Katz, Y., Gerberich, W. W.

MRS - Materials Research Society
5 Conference Proceedings Superlayer residual stress effect on the indentation adhesion measurements

Volinsky, Alex A., Moody, Neville R., Gerberich, William W.

MRS-Materials Research Society
11 Conference Proceedings WEAR AND ADHESION OF THIN CARBON COATINGS

Wang, Hsin-Fu, Nelson, John C., Lin, Chien-Li, Hoehn, Joel W., Gerberich, William W.

MRS - Materials Research Society
6 Conference Proceedings RESIDUAL STRESS EFFECTS IN THE SCRATCH ADHESION TESTING OF TANTALUM THIN FILMS

White, Richard L., Nelson, John, Gerberich, William W.

MRS - Materials Research Society
12 Conference Proceedings INTERFACE ROUGHNESS EFFECTS ON ADHESION OF Ta2N FILMS

Moody, N. R., Venkataraman, S., Nelson, J., Worobey, W., Gerberich, W. W.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12