Under Bump Metallization Development for Eutectic Pb-Sn Solders

Under Bump Metallization Development for Eutectic Pb-Sn Solders

Author(s):

Publication title:

Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

515

Pub. Year:

1998

Page(from):

73

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994218 [1558994211]

Language:

English

Call no.:

M23500/515

Type:

Conference Proceedings

Details

TDL ID:	ZA00019381
Series ID:	PA00000011
Conf. info. (Name):	Symposium on electronic packaging materials science
Conf. info. (Number):	10th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1998.04.14-1998.04.16

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