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Quantitative Measurement of the Effect of Annealing on the Adhesion of Thin Copper Films Using Superlayers

Author(s):
Publication title:
Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
505
Pub. Year:
1998
Page(from):
363
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994102 [1558994106]
Language:
English
Call no.:
M23500/505
Type:
Conference Proceedings

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