Under Bump Metallization Development for High Sn Solders
- Author(s):
Korhonen, T. M. Hong, S. J. Su, P. Zhou, C. Korhonen, M. A. Li, C-Y. - Publication title:
- Thin-films : stresses and mechanical properties VII : symposium held December 1-5, 1997, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 505
- Pub. Year:
- 1998
- Page(from):
- 143
- Pub. info.:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994102 [1558994106]
- Language:
- English
- Call no.:
- M23500/505
- Type:
- Conference Proceedings
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