A New Measurement Method of Microdefects Near the Surface of Si Wafers; Optical Shallow Defect Analyzer (OSDA)

A New Measurement Method of Microdefects Near the Surface of Si Wafers; Optical Shallow Defect Analyzer (OSDA)

Author(s):

Publication title:

Defects in electronic materials II : symposium held December 2-6, 1996, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

442

Pub. Year:

1997

Page(from):

37

Pub. info.:

Pittsburgh, Penn: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558993464 [1558993460]

Language:

English

Call no.:

M23500/442

Type:

Conference Proceedings

Details

TDL ID:	ZA00019374
Series ID:	PA00000011
Conf. info. (Name):	Symposium on defects in electronic materials
Conf. info. (Number):	2nd
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1996.12.02-1996.12.06

Similar Items:

1 Conference Proceedings Evaluation of near-surface microdefects in Czochralski-Si wafers after a CMOS process by an infrared interference method Kitagawara,Y., Aihara,K., Oka,S., Takenaka,T. SPIE-The International Society for Optical Engineering	7 Conference Proceedings New surface photovoltage (SPV) method for high precision measurement of the minority carrier diffusion length and surface recombination velocity in silicon … Faifer, V., Edelman, P., Kontkiewicz, A., Lagowski, J., Hoff, A., Dyukov, V., Pravdivtsev, A., Kornienko, I. Electrochemical Society
2 Conference Proceedings Study of Near-Surface Microdefects in Czochralski-Si Wafers after a CMOS Thermal Process Kitagawara,Y., Aihara,K., Oka,S., Takenaka,T. Trans Tech Publications	8 Conference Proceedings A New Chemical Diagnostic Method for Silicon Defects in Wafer Fabrication Hua,Y.N. SPIE - The International Society for Optical Engineering
3 Conference Proceedings Practical, nondestructive method to profile near-surface and subsurface defects in semiconductor wafers M.A. Nokes, P. Flesher, P. Borden, D. DeBusk, J. Lowell Society of Photo-optical Instrumentation Engineers	9 Conference Proceedings New sample preparation method for improved defect characterization yield on bare wafers Roudin,C.J., Kinney,P.D., Uritsky,Y.S. SPIE - The International Society for Optical Engineering
4 Conference Proceedings A New Waveform Signal Processing Method Based on Adaptive Clustering-Genetic Algorithms Noha Shaaban, Fukuzo Masuda, Hidetsugu Morota American Society of Mechanical Engineers	10 Conference Proceedings Fatigue of Low Carbon Alloy Steel (JIS S45C) and a New Method of Fracture Surface Analysis K. Kida, M. Ishida, K. Mizobe, I. Yoshida, A. Tamura, K. Nakane Trans Tech Publications
5 Conference Proceedings Evaluation of defects in surface Si near Si/BOX interface in SIMOX wafers Sudou, M., Kainuma, M., Nakai, T., Tomizawa, K. Electrochemical Society	11 Conference Proceedings Simple Method for Mapping Optical Defects in Insulating Silicon Carbide Wafers Mier, M., Boeckl, J., Roth, M., Balkas, C., Nelson, M. Trans Tech Publications
6 Conference Proceedings Annealing Behavior of a Light Scattering Tomography Detected Defect near the Surface of Si Wafers Furukawa,J., Iwaoka,N., Furuya,H. Trans Tech Publications	12 Conference Proceedings Modification of a Carbon Electrode Surface by Cold Plasma Treatment for Electric Double-Layer Capacitors Ishikawa, Masashi, Sakamoto, Atsushi, Morita, Masayuki, Matsuda, Yoshiharu, Ishida, Koichi MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12