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Electromigration Damage and Failure Distributions in Al-4wt.%Cu Interconnects

Author(s):
Publication title:
Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
391
Pub. Year:
1995
Page(from):
391
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992948 [1558992944]
Language:
English
Call no.:
M23500/391
Type:
Conference Proceedings

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