The Effects of Processing on the Microstructure of Copper Thin Films on Tantalum Barrier Layers

The Effects of Processing on the Microstructure of Copper Thin Films on Tantalum Barrier Layers

Author(s):

Publication title:

Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

391

Pub. Year:

1995

Page(from):

303

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992948 [1558992944]

Language:

English

Call no.:

M23500/391

Type:

Conference Proceedings

Details

TDL ID:	ZA00019370
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability in microelectronics
Conf. info. (Number):	5th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1995.04.17-1995.04.21

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