A Simple Analysis of Average Mechanical Behavior and Strain Energy Density of Misoriented Grains in a Textured Film

A Simple Analysis of Average Mechanical Behavior and Strain Energy Density of Misoriented Grains in a Textured Film

Author(s):

Publication title:

Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

391

Pub. Year:

1995

Page(from):

97

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992948 [1558992944]

Language:

English

Call no.:

M23500/391

Type:

Conference Proceedings

Details

TDL ID:	ZA00019370
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability in microelectronics
Conf. info. (Number):	5th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1995.04.17-1995.04.21

Similar Items:

1 Conference Proceedings The Influence of Strain Energy Minimization on Abnormal Grain Growth in Copper Thin Films Zielinski, E. M., Vinci, R. P., Bravman, J. C. MRS - Materials Research Society	7 Conference Proceedings THE DETERMINATION OF MECHANICAL PARAMETERS AND RESIDUAL SRESSES FOR THIN FILMS USING MICRO-CANTILEVER BEAMS Hong, S., Weihs, T.P., Bravman, J.C., Nix, W.D. Materials Research Society
2 Conference Proceedings Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film Vinci, R. P., Bravman, J. C. MRS - Materials Research Society	8 Conference Proceedings The Effects of Processing on the Microstructure of Copper Thin Films on Tantalum Barrier Layers Zielinski, E. M., Vinci, R. P., Bravman, J. C. MRS - Materials Research Society
3 Conference Proceedings Finite Element Modeling of Grain Aspect Ratio and Strain Energy Density in a Textured Copper Thin Film Vinci, R. P., Bravman, J. C. MRS - Materials Research Society	9 Conference Proceedings MATERIALS AND STRUCTURES FOR HIGH DENSITY I/O INTERCONNECTION SYSTEMS Hong, S., Bravman, J. C., Weihs, T. P., Kwon, O. K. Materials Research Society
4 Conference Proceedings EFFECT OF COPPER FILM THICKNESS ON STRESS AND STRAIN IN GRAINS OF DIFFERENT ORIENTATION Vinci, R. P., Zielinski, E. M., Bravman, J. C. MRS - Materials Research Society	10 Conference Proceedings In situ High Voltage Electron Microscopy Observations of Deformation and Fracture in Multilayered Materials Wall, M. A., Barbee, T. W., Jr., Weihs, T. P. MRS - Materials Research Society
5 Conference Proceedings MEASUREMENT OF THE DEPENDENCE OF STRESS AND STRAIN ON CRYSTALLOGRAPHIC ORIENTATION IN Cu AND Al THIN FILMS Zielinski, E. M., Vinci, R. P., Bravman, J. C. MRS - Materials Research Society	11 Conference Proceedings An In Situ Electron Microscopy Technique for the Study of Thermally Activated Reactions in Multilayered Materials Wall, M. A., Barbee, T. W., Jr., Weihs, T. P. MRS - Materials Research Society
6 Conference Proceedings MEASURING THE STRENGTH AND STIFFNESS OF THIN FILM MATERIAL BY MECHANICALLY DEFLECTING CANTILEVER MICROBEAMS Weihs, T.P., Hong, S., Bravman, J.C., Nix, W.D. Materials Research Society	12 Conference Proceedings Measuring Enthalpies of Formation Using Thick Multilayer Foils and Differential Scanning Calorimetry Weihs, T. P., Barbee, T. W., Jr., Wall, M. A. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12