Function testing and failure analysis of integrated circuit chip using laser probe

Function testing and failure analysis of integrated circuit chip using laser probe

Author(s):

Tian,X. ( Jilin Univ.(China) )
Yi,M. ( Jilin Univ.(China) )
Zhang,D. ( Jilin Univ.(China) )
Sun,W. ( Jilin Univ.(China) )
Gao,Y. ( Jilin Univ.(China) )

Publication title:

Integrated Optoelectronics II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3551

Pub. Year:

1998

Page(from):

153

Page(to):

156

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819430120 [0819430129]

Language:

English

Call no.:

P63600/3551

Type:

Conference Proceedings

Details

TDL ID:	ZA00019230
Series ID:	PA00000029
Conf. info. (Name):	Photonics China : Integrated Optoelectronics
Conf. info. (Number):	1998 : 2nd
Conf. info. (Venue):	Beijing, China
Conf. info. (Date):	1998.09.18-1998.09.19

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