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2nd Level Reliability Investigation of a Memory Package using Power Cycling Test

Author(s):
Qi,Quan ( Hewlett-Packard Company )  
Publication title:
Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3906
Pub. Year:
1999
Page(from):
688
Page(to):
693
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815585 [0930815580]
Language:
English
Call no.:
P63600/3906
Type:
Conference Proceedings

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