Blank Cover Image

Effects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board

Author(s):
Publication title:
Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3906
Pub. Year:
1999
Page(from):
592
Page(to):
598
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815585 [0930815580]
Language:
English
Call no.:
P63600/3906
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Reliability of 96.5Sn-3.5Ac Lead-Free Solder-Bumped Wafer Level Chip Scale Package (WLCSP) on Build-Up Microvia Printed Circuit Board

Lau,John H., Lee,S.-W.Ricky

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Solder Joint Reliability of a Low Cost Chip Size Package - NuCSP

Lau,John.H.

IMAPS
2 Technical Paper Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill

Lau, John H., Lee, S.-W. Ricky

The American Society of Mechanical Engineers
8 Conference Proceedings FLIP-CHIP BUMP BONDING RELIABILITY AND PROCESS IMPROVEMENT

Koh, Wei H., Mayemura, S., Kuipers, W.

Materials Research Society
3 Technical Paper Solder joint reliability of plastic ball grid array with solder bumped flip chip

Lee, S-W. Ricky, Lau, John H.

The American Society of Mechanical Engineers
9 Conference Proceedings Effect of Al Pad Surface Morphology on the Flip-Chip Solder Bump Reliability

Yau, Esther, W.C., Law, Simon P.C., Wei, J.Z., Chan, Phillip C.H.

IMAPS
4 Conference Proceedings Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chips on Low Cost Substrates

Lau,John H., Chang,Chris, Chen,Chih-Chiang

SPIE - The International Society for Optical Engineering
10 Conference Proceedings Creep Behaviors of Flip Chip on Board with 96.5Sn-3.5Ag and 100 in Lead-Free Solder Joints

Lau,John H., Pan,Stephen H.

IMAPS
5 Conference Proceedings How to Select Underfill Materials for Solder Bumped Flip Chips on Low Cost Substrates?

Lau,John H., Chang,Chris

SPIE - The International Society for Optical Engineering, IMAPS
11 Conference Proceedings Flip-chip assembly and reliability using gold/tin solder bumps

Oppermann, H., Hutter, M., Klein, M., Reichl, H.

SPIE - The International Society of Optical Engineering
6 Technical Paper Solder joint reliability of wafer level chip scale packages (WLCSP): A time-temperature-dependent creep analysis

Lau, John H., Lee, S.-W. Ricky, Chang, Chris, Chen, Chih-Chiang

The American Society of Mechanical Engineers
12 Conference Proceedings Experimental Study for Underfill of Flip Chip Packages

Jong, W-R., Chen, S., Lai, C., Tsai, H., Liu, H., Ho, S., Lo, W-Y.

Society of Plastics Engineers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12