Flip Chip Bonding Technology using Resin for Adhesion

Flip Chip Bonding Technology using Resin for Adhesion

Author(s):

Publication title:

Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3906

Pub. Year:

1999

Page(from):

143

Page(to):

148

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815585 [0930815580]

Language:

English

Call no.:

P63600/3906

Type:

Conference Proceedings

Details

TDL ID:	ZA00019023
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	1999
Conf. info. (Venue):	Chicago, Illinois, USA
Conf. info. (Date):	1999.10.26-1999.10.28

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