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Use and function of TXRF(total reflection x-ray fluorescence)for routine in fab metallic monitoring

Author(s):
Publication title:
In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3743
Pub. Year:
1999
Page(from):
157
Page(to):
161
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819432230 [0819432237]
Language:
English
Call no.:
P63600/3743
Type:
Conference Proceedings

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