Analysis of in-situ vibration monitoring for end-point detection of CMP planarization processes

Analysis of in-situ vibration monitoring for end-point detection of CMP planarization processes

Author(s):

Hetherington,D.L. ( Sandia National Labs. )
Stein,D.J.
Lauffer,J.P.
Wyckoff,E.E.
Shingledecker,D.M.

Publication title:

In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing : 19-21 May 1999, Edinburgh, Scotland

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3743

Pub. Year:

1999

Page(from):

89

Page(to):

101

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819432230 [0819432237]

Language:

English

Call no.:

P63600/3743

Type:

Conference Proceedings

Details

TDL ID:	ZA00019008
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing Technologies : In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
Conf. info. (Number):	1999
Conf. info. (Venue):	Edinburgh, Scotland
Conf. info. (Date):	1999.05.19-1999.05.21

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