Design of CMOS ICs for flip-chip integration with optoelectronic device arrays

Design of CMOS ICs for flip-chip integration with optoelectronic device arrays

Author(s):

Chandramani,P. ( Univ.of North Carolina/Charlotte )

Publication title:

Optoelectronic integrated circuits and packaging III : 28-29 January 1999, San Jose, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3631

Pub. Year:

1999

Page(from):

198

Page(to):

204

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819431011 [081943101X]

Language:

English

Call no.:

P63600/3631

Type:

Conference Proceedings

Details

TDL ID:	ZA00018998
Series ID:	PA00000029
Conf. info. (Name):	Photonics West : Optoelectronic Integrated Circuits and Packaging
Conf. info. (Number):	1999 : 3rd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1999.01.28-1999.01.29

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