Blank Cover Image

MEMS IC test probe utilizing fritting contacts

Author(s):
Itoh,T. ( Univ.of Tokyo )
Kataoka,K.
Engelmann,G.
Wolf,J.
Ehrmann,O.
Reichl,H.
Suga,T.
2 more
Publication title:
Design, Test, Integration, and Packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4019
Pub. Year:
2000
Page(from):
244
Page(to):
249
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436450 [0819436453]
Language:
English
Call no.:
P63600/4019
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings FABRICATION OF A HIGH-DENSITY MCM-D FOR A PIXEL DETECTOR SYSTEM USING A BCB/CU TECHNOLOGY

Toepper,Michael J., Dietrich,L., Engelmann,G., Fehlberg,S., Wolf,J., Ehrmann,O., Reichl,H., Becks,K.-H.

IMAPS
7 Conference Proceedings Instruction fetch characteristics of media processing

Fritts, J.E., Wolf, W.H.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings System Integration for High Frequency Applications

Wolf,Juergen., Reichl,H., Ehrmann,O., Buschick,K., Schmuckle,F.J., Heinrich,W., Toepper,M., Owzar,A.

IMAPS
8 Conference Proceedings Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops (Invited Paper)

Oppermann, H.H., Hutter, M., Engelmann, G., Reichl, H.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings MCM-D with Embedded Active and Passive Components

Topper,M., Wolf,J., Glaw,V., Buschidk,K., Dabek,A., Ehrmann,O., Reichl,H.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings High Density Pixel Detector Module using Flip Chip and Thin Film Technology

Wolf,Juergen, Toepper,M., Scherpinski,K., Petter,D., Kallmayer,C., Ehrmann,O., Reichl,H., Becks,K.H., Gerlach,P., …

IMAPS, SPIE-The International Society for Optical
4 Conference Proceedings Electrochemically Deposited Microstructures in Packaging and System Integration*

Engelmann, G., Wolf, J., Dietrich, L., Fehlberg, S., Mueller, S., Ehrmann, O., Reichi, H.

Electrochemical Society
10 Conference Proceedings Development of an UHV Surface Activated Bonding Machine for MEMS Packaging

Howlader, M.M.R., Okada, H., Itoh, T., Suga, T.

Electrochemical Society
5 Conference Proceedings Thin Chip Integration (TCI-Modules)-A Novel Technique for Manufacturing Three Dimensional IC-Packages

Toepper,M., Scherpinski,K., Spoerle,H.-P., Landesberger,C., Ehrmann,O., Reichl,H.

IMAPS
11 Conference Proceedings Ion projection lithography for IC manufacturing

Ehrmann,A., Loschner,H., Kasmaier,R.

SPIE - The International Society for Optical Engineering
6 Conference Proceedings Novel laser contact probe for periodontal treatment

Watanabe,H., Kataoka,K., Ishikawa,I.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Understanding multimedia application characteristics for designing programmable media processors

Fritts,J., Wolf,W.H., Liu,B.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12