Thick-film positive DUV photoresist for implant layer application

Thick-film positive DUV photoresist for implant layer application

Author(s):

Mori,M. ( Shipley Co.,Inc. )

Publication title:

Advances in resist technology and processing XVII : 28 February - 1 March 2000, Santa Clara, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3999

Pub. Year:

2000

Vol.:

Part2

Page(from):

843

Page(to):

853

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819436177 [0819436178]

Language:

English

Call no.:

P63600/3999

Type:

Conference Proceedings

Details

TDL ID:	ZA00018975
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in resist technology and processing
Conf. info. (Number):	2000 : 17th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2000.02.28-2000.03.01

Similar Items:

1 Conference Proceedings DUV positive resist system designed for Micrascan use J.W. Thackeray, T.G. Adams, M.F. Cronin, T.H. Fedynyshyn, J.M. Mori Society of Photo-optical Instrumentation Engineers	7 Conference Proceedings Ultrathin DUV resists for logic applications Thackeray, J.W., Cameron, J.F., Cronin, M.F., Brykailo, W., Kang, D. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Investigation of lithographic performance for 120-nm and sub-120-nm gate applications of advanced ArF resists based on VEMA co-polymers Kavanagh, R.J., Orsula, G.W., Hellion, M., Barclay, G.G., Caporale, S., Pugliano, N., Thackeray, J.W., Mortini, B.P. SPIE-The International Society for Optical Engineering	8 Conference Proceedings Optimizing a DUV positive resist for metal layers Malik, S., Maxwell, B., Gandolfi, A., Ornaghi, A., Whewell, A., Uhnak, K., Volpi, S., Driessche, V. Van, Sarubbi, T. R., … SPIE - The International Society of Optical Engineering
3 Conference Proceedings Lithographic performance of a positive photoresist for thick-film applications A.F. Renaldo, L.J. Lauchlan, D.C. Hofer, W.D. Hinsberg, D.R. McKean Society of Photo-optical Instrumentation Engineers	9 Conference Proceedings Refractive indices in thick photoresist films as a function of bake conditions and film exposure Ficner,S.A., Dammel,R.R., Perez,Y.M., Gardiner,A.B., Willson,C.G. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Influence of backbone chemistry on the post-exposure bake temperature sensitivity of 193-nm photoresists Bae, Y.C., Ogawa, T., Kavanagh, R.J., Kobayashi, T., Lindsay, T., Tanaka, T., Xu, C.B., Orsula, G., DeSisto, J., … SPIE - The International Society of Optical Engineering	10 Conference Proceedings Development of DUV resist formulations with excellent performance on metal substrates Rajaratnam,M.M., Cameron,J.F., Georger,J.H., Kang,D., Prokopowicz,G., Sinta,R.F., Thackeray,J.W. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Development of two new positive DUV photoresists for use with direct-write e-beam lithography Mancini,D.P., Resnick,D.J., Nordquist,K.J., Dauksher,W.J., Thackeray,J.W., McCord,M.A. SPIE-The International Society for Optical Engineering	11 Conference Proceedings Design and properties of new deep-UV positive photoresist Choi,S.-J., Jung,S.-Y., Kim,C.-H., Park,C.-G., Han,W.-S., Koh,Y.-B., Lee,M.-Y. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Characterization of advanced DUV photoresists Krishna, M. S., Gurer, E., Lee, E. C., Lewellen, J. W., Golden, K. M., Salois, J. W., Flores, G. E., Wackerman,, … SPIE - The International Society of Optical Engineering	12 Conference Proceedings Mechanistic understanding of post-etch roughness in 193-nm photoresists Bae, Y.C., Barclay, G.G., Bolton, P.J., Kavanagh, R.J., Bu, L., Kobayashi, T., Adams, T., Pugliano, N., Thackeray, J.W. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12