Novel wafer track-based resolution enhancement technology for 248-nm DUV lithography
- Author(s):
- Zhong,T.X. ( Silicon Valley Group )
- Gurer,E.
- Lewellen,J.W.
- Lee,E.C.
- Publication title:
- Advances in resist technology and processing XVII : 28 February - 1 March 2000, Santa Clara, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3999
- Pub. Year:
- 2000
- Vol.:
- Part2
- Page(from):
- 793
- Page(to):
- 804
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819436177 [0819436178]
- Language:
- English
- Call no.:
- P63600/3999
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Novel spin-coating technology for 248-nm/193-nm DUV lithography and low-k spin on dielectrics of 200-mm/300-mm wafers
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
8
Conference Proceedings
Characterization of sub-0.18-ヲフm critical dimension pattern collapse for yield improvement
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Optimization for full-chip process of 130-nm technology with 248-nm DUV lithography
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
Limitation of optical lithography for various resolution enhancement technologies
SPIE-The International Society for Optical Engineering |