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Fatigue Crack Growth Behavior of Small Sn-Bi-Ag Solder Joints

Author(s):
Publication title:
Electronic packaging materials science VIII : symposium held April 17-20, 1995, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
390
Pub. Year:
1995
Page(from):
177
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992931 [1558992936]
Language:
English
Call no.:
M23500/390
Type:
Conference Proceedings

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