Blank Cover Image

EFFECTIVENESS OF NITRIDE DIFFUSION BARRIERS IN A SELF-ENCAPSULATED COPPER-BASED METALLIZATION

Author(s):
Adams, D.
Spreitzer, R. L.
Russell, S. W.
Theodore, N. D.
Alford, T. L.
Mayer, J. W.
1 more
Publication title:
Advanced metallization for devices and circuits--science, technology, and manufacturability : symposium held April 4-8, 1994, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
337
Pub. Year:
1994
Page(from):
231
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992375 [1558992375]
Language:
English
Call no.:
M23500/337
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings INTERFACIAL REACTIONS OF COPPER / REFRACTORY ALLOY AND BILAYER FILMS ON SiO2

Spreitzer, R. L., Rafalski, S. A., Adams, D., Russell, S. W., Atzmon, Z., Li, J., Alford, T. L., Mayer, J. W.

MRS - Materials Research Society
7 Conference Proceedings Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

Bai, G., Wittenbrock, S., Ochoa, V., Villasol, R., Chiang, C., Marieb, T., Gardner, D., Mu, C., Fraser, D., Bohr, M.

MRS - Materials Research Society
2 Conference Proceedings ENHANCED ADHESION OF COPPER FILMS TO SiO2, PSG AND BPSG BY REFRACTORY METAL ADDITIONS

Rafalski, S. A., Spreitzer, R. L., Russell, S. W., Alford, T. L., Li, J., Moinpour, M., Moghadam, F., Mayer, J. W.

MRS - Materials Research Society
8 Conference Proceedings Kinetics Model For The Self-Encapsulation Of Ag/Al Bilayers

Wang, Y., Alford, T.L., Mayer, J.W.

Materials Research Society
3 Conference Proceedings Low Temperature Oxidation of Silicon after Copper Ion Implantation

Jaquez, E. J., Alford, T. L., Theodore, N. D., Adams, D., Li, Jian, Russell, S. W., Anders, Simone

MRS - Materials Research Society
9 Conference Proceedings Copper-Based Metallization

Li J., Hong S., Russell W. S., Mayer W. J.

Kluwer Academic Publishers
4 Conference Proceedings Indluence of Interfacial Copper on the Ti-SiO2 Reaction during Nitridatin of Cu-Ti Films

Adams, Daniel, Alford, T. L., Theodore, N. D., Laursen, T., Russell, S. W., Kim, M. J.

MRS - Materials Research Society
10 Conference Proceedings Encapsulation of Silver Via Nitridation of Ag/Ti Bilayer Structures

Zou, Y. L., Alford, T. L., Adams, D., Laursen, T., Tu, K.-N., Morton, R., Lau, S. S.

MRS - Materials Research Society
5 Conference Proceedings INVESTIGATION OF CHROMIUM NITRIDATION USING ION BEAM RESONANCE ANALYSIS

Russell, S. W., Bair, A. E., Rack, M. J., Adams, D., Spreitzer, R. L., Alford, T. L., Culbertson, R. J.

MRS - Materials Research Society
11 Conference Proceedings Cobalt and Titanium Metallization of SiGeC for Shallow Contacts

Bair, A. E., Alford, T. L., Atzmon, Z., Marcus, S. D., Doller, D. C., Morton, R., Lau, S. S., Mayer, J. W.

MRS - Materials Research Society
6 Conference Proceedings A Study of Tungsten-Titanium Barriers in Silver Metallization

S. Bhagat, N.D. Theodore, T.L. Alford

Materials Research Society
12 Conference Proceedings THE EFFECT OF COPPER ON THE TITANIUM-SILICON DIOXIDE REACTION AND THE IMPLICATIONS FOR SELF-ENCAPSULATING, SELF-ADHERING METALLIZATION LINES

Russell, Stephen W., Li, Jian, Strane, W., Mayer, James W.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12