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Applying copper alloys using new mold cooling software

Author(s):
Publication title:
ANTEC '96 : Plastics-Racing into the Future, May 5-10, Indianapolis : conference proceedings
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
42
Pub. Year:
1996
Vol.:
Vol. 1
Page(from):
1041
Page(to):
1045
Pub. info.:
Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
Language:
English
Call no.:
S42700/970361
Type:
Conference Proceedings

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