Blank Cover Image

Reliability of silicon nitride as structural material in MEMS

Author(s):
Publication title:
Materials and Device Characterization in Micromachining II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3875
Pub. Year:
1999
Page(from):
174
Page(to):
183
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819434722 [0819434728]
Language:
English
Call no.:
P63600/3875
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Environment-induced failure modes of thin film resonators

Kazinczi,R., Mollinger,J.R., Bossche,A.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Low-cost reliable transfer mold sensor packaging concept

Bossche,A., Cotofana,C.V.B., Kaldenberg,P., Van Dommelen,I., Mollinger,J.R.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Adsorption-Induced Failure Modes of Thin-Film Resonators

Kazinczi, R., Mollinger, J.R., Bossche, A.

Materials Research Society
8 Conference Proceedings Silicon Carbon-Nitride Ceramics - A High Temperature Semiconductor Material for MEMS Applications

Saravanan, R.A., Liew, Li-Anne, Bright, Victor M., Raj, Rishi

IMAPS
3 Conference Proceedings Design of low-cost resonant mode sensors

Kazinczi, R., Turmezei, P., Mollinger, J.R., Bossche, A.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Silicon Germanium Epitaxy: A New Material For MEMS

Boreenstein, J.T., Gerrish, N.D., White, R., Currie, M.T., Fitzgerald, E.A.

Materials Research Society
4 Conference Proceedings MEMS packaging: state of the art and future trends (Invited Paper)

Bossche,A., Cotofana,C.B.V., Mollinger,J.R.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings A Reliability Model for Time Dependent Dielectric Breakdown (TDDB) in Silicon Nitride Capacitors

Scarpulla, J., Ahlers, E.D., Eng, D.C., Leung, D.L., Olson, S.R., Wu, C.S.

Electrochemical Society
5 Conference Proceedings Novel wafer-through technique for interconnects

Kutchoukov, V. G., Mollinger, J.R., Bossche, A.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings MICROWAVE PROCESSING OF SILICON NITRIDE

Tiegs, T. N., Kiggans Jr., J. O., Kimrey Jr., H. D.

Materials Research Society
6 Conference Proceedings Stress analysis for the optimization of a new plastic package for optical sensors

Cotofana,C.V.B., Bossche,A., Mollinger,J.R., Kaldenberg,P.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Materials Issues in the Application of Silicon Nitride Films in Silicon MEMS

Moore, David F., Bostock, Roger M., Boyle, Paul, Conradie, Ewan H.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12