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MODELING AND ELECTRICAL ANALYSIS OF SEAMLESS HIGH OFF-CHIP CONNECTIVITY(SHOCC)INTERCONNECTS

Author(s):
Schaper,Leonard ( University of Arkansas )
Alfonso,S.
Parkerson,J.P
Brown,W.D.
Ang,S.S.
Naseem,H.A.
1 more
Publication title:
1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3830
Pub. Year:
1999
Page(from):
327
Page(to):
331
Pub. info.:
Reston, VA: IMAPS
ISSN:
0277786X
ISBN:
9780930815578 [0930815572]
Language:
English
Call no.:
P63600/3830
Type:
Conference Proceedings

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