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MICROJET PRINTING OF SOLDER AND POLYMERS FOR MULTI-CHIP MODULES AND CHIP-SCALE PACKAGES

Author(s):
Publication title:
1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3830
Pub. Year:
1999
Page(from):
242
Page(to):
247
Pub. info.:
Reston, VA: IMAPS
ISSN:
0277786X
ISBN:
9780930815578 [0930815572]
Language:
English
Call no.:
P63600/3830
Type:
Conference Proceedings

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