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Finite-element analysis of solder joint strength in laser diode packaging

Author(s):
Chang,C.-H. ( National Sun Yat-sen Univ. )
Sheen,M.-T.
Kuang,J.-H.
Chen,C.-C.
Wang,G.-L.
Cheng,W.-H.
Chang,H.-L.
Wang,S.-C.
Wang,C.
Wang,C.-M.
5 more
Publication title:
Optoelectronic Materials and Devices II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4078
Pub. Year:
2000
Page(from):
646
Page(to):
651
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819437174 [0819437174]
Language:
English
Call no.:
P63600/4078
Type:
Conference Proceedings

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