Blank Cover Image

Reduction of wafer-scale error between DI and FI in multilevel metallization hy adjusting edge detedion method

Author(s):
Bae,S.-G. ( Hyundai Electronics Industries Co.,Ltd. )
Kim,Y.-K.
Park,K.-Y.
Kim,J.-S.
Lee,W.-G.
Lee,S.-W.
Lee,D.-H.
2 more
Publication title:
Metrology, inspection, and process control for microlithography XIV : 28 February - 2 March 2000, San Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3998
Pub. Year:
2000
Page(from):
460
Page(to):
469
Pub. info.:
Bellingham, Wash.: SPIE - The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819436160 [081943616X]
Language:
English
Call no.:
P63600/3998
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Wafer-induced reading error in metal sputtering process

Kim,D.-J., Oh,S.-H., Yeo,G.-S., Bae,Y.-G., Kim,J.-H., Kim,Y.-H.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings A scalable SIMD digital signal processor for high-quality multifunctional printer systems

Kang, H. -J., Choi, Y., Kim, K., Park, I. -C., Kim, J. -W., Lee, E. -H., Gahang, G. -S.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Reliability of Electrodeposited Copper and ECRCVD SiOF Films for Multilevel Metallization

Kim, Y-A., Kim, Y-I., Lee, K-W., Lee, S., Oh, K., Park, J-W., Sohn, S., Yang, S-H.

Materials Research Society
8 Conference Proceedings Improved characteristics of rainbow defects with novel wafer edge exposure technique

Shim, K.-C., Kim, M.-S., Lee, E.-S., Lee, C.-S., Gil, M.-G., Kim, B.-H., In, J.-S., Yoon, T.-B., Kim, J.-S.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings ArF photoresist parameter optimization for mask error enhancement factor reduction [5853-60]

Lee, C. H., Han, S., Park, K. S., Yoon, S., Kang, H. Y., Oh, H. W., Lee, J. E., Kim, Y. H., Kim, T. S., Oh, H.-K.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Improvement of metal photo process margin with OPC and CMP for 0.14-μm DRAM technology node and beyond

Bae,D., Bae,J.-S., Sung,S.-W., Park,J.-S., Rhie,S.-U., Shin,D.-W., Chung,T.-Y., Kim,K.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Electrical Characterization of Slurry Particles and Their Interactions With Wafer Surfaces

Jeong, H-D., Kim, H-G., Lee, S-H., Moon, D-K., Park, J-G.

Materials Research Society
10 Conference Proceedings Optimum PEC conditions under resist heating effect reduction for 90-nm-node mask writing

Park, E.S., Lee, J.H,, Park, D.I., Jeong, W.-G., Seo, S.K., Kim, S.-S., Choi, S.-S., Jeong, S.-H.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect

Kim,Y.T., Kim,D.J., Lee,S., Park,Y.K., Kim,I.-S., Park,J.-W.

SPIE - The International Society for Optical Engineering
11 Conference Proceedings Synthesis and Characterization of Nanosized ITO Powders by Glycothermal Processing

Bae, D. S., Kim, H. K., Kim, R. H., Kim, J. W., Lee, J. H., Park, S. W., Han, K. S.

Trans Tech Publications
6 Conference Proceedings Wafer scale error induced by bottom antireflective coating

Kim,D.-S., Jeong,J.-H., Nam,B.-H., Hwang,Y.J., Song,Y.J.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Web-based real-time multiview 3D display system

Park, Y.-G., Bae, K.-H., Lee, S.-T., Kim, E.-S.

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12