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Thermal and Electromigration Strain Distributions in 10-ｦﾌm-Wide Aluminum Conductor Lines Measured by X-ray Microdiffraction

Author(s):
Wang, P-C.
Cargill, G. S., III.
Noyan, I. C.
Liniger, E. G.
Hu, C-K.
Lee, K. Y.
1 more
Publication title:
Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
473
Pub. Year:
1997
Page(from):
273
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993778 [1558993770]
Language:
English
Call no.:
M23500/473
Type:
Conference Proceedings

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