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Void Elongation Phenomena Observed in Polycrystalline Cu Interconnects at High Current Density Stressing Conditions

Author(s):
Publication title:
Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
473
Pub. Year:
1997
Page(from):
229
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993778 [1558993770]
Language:
English
Call no.:
M23500/473
Type:
Conference Proceedings

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