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Low-power multichip module and board-level links for data transfer

Author(s):
Carson,R.F. ( Sandia National Labs. )
Hardin,T.L.
Warren,M.E.
Lear,K.L.
Lovejoy,M.L.
Seigal,P.K.
Craft,D.C.
Enquist,P.J.
3 more
Publication title:
Optoelectronic Interconnects and Packaging IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3005
Pub. Year:
1997
Page(from):
99
Page(to):
109
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819424167 [0819424161]
Language:
English
Call no.:
P63600/3005
Type:
Conference Proceedings

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