Back side emission microscopy for failure analysis
- Author(s):
- Publication title:
- Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2874
- Pub. Year:
- 1996
- Page(from):
- 238
- Page(to):
- 247
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819422729 [081942272X]
- Language:
- English
- Call no.:
- P63600/2874
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society for Optical Engineering |
7
Conference Proceedings
304 mW green light emission by frequency doubling of a high-power 1060-nm DBR semiconductor laser diode
Society of Photo-optical Instrumentation Engineers |
2
Conference Proceedings
Confocal microscopy scanned by digital micromirror device with stray light filters
Society of Photo-optical Instrumentation Engineers |
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Practical approach for AAPSM image imbalance correction for sub-100-nm lithography
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Well Thickness and Doping Effects, and Room-Temperature Emission Mechanisms in InGaN/GaN and GaN/AlGaN Multiple-Quantum-Wells
MRS - Materials Research Society |
SPIE - The International Society of Optical Engineering |
5
Conference Proceedings
Long-period fiber grating effects with double-sided loading on fiber (Invited Paper)
SPIE-The International Society for Optical Engineering |
11
Conference Proceedings
Investigation on the mechanism of the 193-nm resist linewidth reduction during the SEM measurement
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |