Accurate prediction of kill ratios based on KLA defect inspection and critical area analysis

Accurate prediction of kill ratios based on KLA defect inspection and critical area analysis

Author(s):

Elias,A. ( Carnegie Mellon Univ. )
Strojwas,A.J.
Maly,W.P.
Nurani,R.

Publication title:

Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2874

Pub. Year:

1996

Page(from):

75

Page(to):

84

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819422729 [081942272X]

Language:

English

Call no.:

P63600/2874

Type:

Conference Proceedings

Details

TDL ID:	ZA00018422
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Conf. info. (Number):	1996 : 2nd
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1996.10.16-1996.10.17

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