CHIP SCALE PACKAGING WITH HIGH RELLABILITY FOR MCM APPLICATIONS
- Author(s):
Loboda,Mark ( Dow Corning Corporation ) Camilletti,R.C. Goodman,L.A. White,L. Pinch,H.L. Shaw,J. Patel,V.K. Wu,C.P. Adema,G.M. - Publication title:
- 1996 International Conference on Multichip Modules : proceedings, April 17-19, 1996, Denver, Colorado
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2794
- Pub. Year:
- 1996
- Page(from):
- 257
- Page(to):
- 262
- Pub. info.:
- Reston, Va.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815479 [0930815475]
- Language:
- English
- Call no.:
- P63600/2794
- Type:
- Conference Proceedings
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