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CHIP SCALE PACKAGING WITH HIGH RELLABILITY FOR MCM APPLICATIONS

Author(s):
Loboda,Mark ( Dow Corning Corporation )
Camilletti,R.C.
Goodman,L.A.
White,L.
Pinch,H.L.
Shaw,J.
Patel,V.K.
Wu,C.P.
Adema,G.M.
4 more
Publication title:
1996 International Conference on Multichip Modules : proceedings, April 17-19, 1996, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2794
Pub. Year:
1996
Page(from):
257
Page(to):
262
Pub. info.:
Reston, Va.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815479 [0930815475]
Language:
English
Call no.:
P63600/2794
Type:
Conference Proceedings

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