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HERMETIC THICK FILM MULTICHIP MODULES

Author(s):
Publication title:
1996 International Conference on Multichip Modules : proceedings, April 17-19, 1996, Denver, Colorado
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2794
Pub. Year:
1996
Page(from):
52
Page(to):
57
Pub. info.:
Reston, Va.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815479 [0930815475]
Language:
English
Call no.:
P63600/2794
Type:
Conference Proceedings

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