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Etched bonded silicon wafers as test objects for the resolution power of subsurface voids

Author(s):
Publication title:
Acousto-optics and applications II : 22-26 May 1995, Gdańsk-Jurata, Poland
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2643
Pub. Year:
1995
Page(from):
327
Page(to):
333
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819420138 [0819420131]
Language:
English
Call no.:
P63600/2643
Type:
Conference Proceedings

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