Use of Temperature-Modulated and Step-Scan DSC and DMA to Study Curing in an Epoxy Composite

Use of Temperature-Modulated and Step-Scan DSC and DMA to Study Curing in an Epoxy Composite

Author(s):

Bilyeu, B. ( University of North Texas )
Brostow, W.
Menard, K. P.

Publication title:

ANTEC 2001, conference proceedings, Dallas, Texas, May 6-10

Title of ser.:

Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers

Ser. no.:

47

Pub. Year:

2001

Pt.:

2

Page(from):

2095

Page(to):

2099

Pages:

5

Pub. info.:

Brookfield Center, CT: Society of Plastics Engineers

ISBN:

9781587160981 [1587160986]

Language:

English

Call no.:

S42700/47

Type:

Conference Proceedings

Details

TDL ID:	ZA00017839
Series ID:	PA00000030
Conf. info. (Name):	ANTEC 2001
Conf. info. (Number):	2001
Conf. info. (Venue):	Dallas, TX, USA
Conf. info. (Date):	2001.05.06-2001.05.10

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