Improving the Reliability and Performance of Microelectronic Packaging
- Author(s):
Weaver, J. ( Texas A&M University ) Gam, K. T. ( Dexter Corporation ) Oh, Y. Bonnaud, L. Suh, S. Sue, H. -J. Todd, M. Ji, Q. Edwards, M. - Publication title:
- ANTEC 2001, conference proceedings, Dallas, Texas, May 6-10
- Title of ser.:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- Ser. no.:
- 47
- Pub. Year:
- 2001
- Pt.:
- 2
- Page(from):
- 1340
- Page(to):
- 1343
- Pages:
- 4
- Pub. info.:
- Brookfield Center, CT: Society of Plastics Engineers
- ISBN:
- 9781587160981 [1587160986]
- Language:
- English
- Call no.:
- S42700/47
- Type:
- Conference Proceedings
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